| 摘要 |
To isolate at least one electric or electronic element ( 16, 58 ), for example an interconnection integrated onto a semiconductor substrate ( 12 ), this device comprises at least one isolation means chosen from an isolating layer ( 84, 86, 90 ) extending in the substrate and an assembly whose height exceeds that of the element and which comprises, on either side of the element, at least two superposed conductors ( 60 62 64, 66 68 70 ), which are integrated into the substrate and extend along the element.
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