发明名称 Integrated patch antenna and electronics assembly and method for fabricating
摘要 An integrated patch antenna and electronics assembly ( 300 ) comprises an antenna dielectric layer ( 305 ), a ground plane layer ( 310 ) disposed on a first side of the antenna dielectric layer, a printed circuit dielectric layer ( 315 ) disposed on the ground plane layer opposite the antenna dielectric layer, a patterned conductive metal foil layer ( 320 ) on a component surface ( 323 ) of the assembly ( 300 ), and a conductive metal foil antenna patch ( 325 ) disposed on a second side of the antenna dielectric layer that is in a patch side ( 391 ) of the assembly. In some embodiments, a plated through hole ( 330 ) couples the antenna patch to the patterned conductive metal foil layer. In some embodiments, there are one or more printed circuit dielectric layers ( 316, 341, 346, 351 ) disposed over the antenna patch on the antenna patch side of the assembly. In some embodiments, pairs of printed circuit dielectric layers ([ 315, 316], [340, 341], [345, 346], [350, 351 ]) are formed simultaneously on each side of the assembly.
申请公布号 US7030815(B2) 申请公布日期 2006.04.18
申请号 US20040936286 申请日期 2004.09.08
申请人 MOTOROLA, INC. 发明人 DUNN GREGORY J.;PETSINGER JEFFREY M.;ZIEMER WILLIAM R.
分类号 H01Q1/38 主分类号 H01Q1/38
代理机构 代理人
主权项
地址