| 摘要 |
A sound detection mechanism allowing a diaphragm and rear electrodes to be formed on a substrate by a simple process. An acoustic hole forming through holes (Ba) is formed on the front surface side of the substrate (A), a second protective film (406), a sacrifice layer D (407), and a metal film (408) are laminated on the front surface side at the position of the acoustic hole, and etching is performed from the rear surface side of the substrate (A) to the depth of the acoustic hole to form an acoustic opening (E). Then, etching is performed from the rear surface side of the substrate (A) through the acoustic hole to remove the sacrifice layer (407) so as to form a space area (F) between the diaphragm (C) formed of the metal film (408) and the substrate (A) and to form the through holes (Ba), and the sacrifice layer (407) left after the etching is used as a spacer (D) keeping a distance between the back electrode (B) and the diaphragm (C).
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