发明名称 Method and apparatus for metallization of large area substrates
摘要 A system and method for processing large area substrates. In one embodiment, a system for processing large area substrates includes prep station, a stamping station and a stamp that is automatically moved between the stamping station and the prep station. The stamping station is adapted to retain a large area substrate thereon. The stamp has a patterned bottom surface that is adapted for microcontact printing. The prep station is for applying a precursor to the patterned bottom surface of the stamp. In one embodiment, a method for processing large area substrates includes the steps of disposing a large area substrate on a platen, inking a stamp adapted for microcontact printing, and automatically contacting a bottom of the stamp to the large area substrate supported on a platen.
申请公布号 US7029529(B2) 申请公布日期 2006.04.18
申请号 US20020247403 申请日期 2002.09.19
申请人 APPLIED MATERIALS, INC. 发明人 LAW KAM S.;BACHRACH ROBERT Z.;WHITE JOHN M.;SHANG QUANYUAN
分类号 B05C1/02;B05C13/02;B05D1/00;B05D7/14;C23C18/16;H01L21/288;H01L21/768;H05K3/12;H05K3/18 主分类号 B05C1/02
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