Semiconductor chip pick and place process and equipment

摘要

A process and tooling for removing a semiconductor chip ( 31 ) from a handling tape ( 321 ) without damage to either the chip or tape by one or more horizontal beam type ejector tools ( 333 ) driven by a variable speed motor ( 332 ) applying uniform pressure to the tape and chip backside. Each tool ( 333 ) emerges from a rigid support surface through an aperture which also serves to supply vacuum to hold the chip in alignment prior to ejection, and in turn allows planar removal of the chip by a pick-up arm ( 351 ).