发明名称 |
High frequency apparatus for transmitting or processing high frequency signal |
摘要 |
In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate, including at least the recessed portion of the substrate, and a dielectric support film is on the substrate opposite the recessed portion of the substrate with an air space between the dielectric support film and the substrate. A second interconnecting conductor is on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and reduced transmission loss and can be made in a simple manufacturing process.
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申请公布号 |
US7030721(B2) |
申请公布日期 |
2006.04.18 |
申请号 |
US20030421780 |
申请日期 |
2003.04.24 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIDA YUKIHISA;NISHINO TAMOTSU;SUEHIRO YOSHIYUKI;LEE SANGSEOK;MIYAGUCHI KENICHI;JIAO JIWEI |
分类号 |
H01F5/00;H05K1/02;H01F17/00;H01P1/203;H01P3/00;H01P3/08;H01P5/18;H01P11/00 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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