发明名称 High frequency apparatus for transmitting or processing high frequency signal
摘要 In a high frequency apparatus for transmitting or processing a high frequency signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate, including at least the recessed portion of the substrate, and a dielectric support film is on the substrate opposite the recessed portion of the substrate with an air space between the dielectric support film and the substrate. A second interconnecting conductor is on a part of a surface of the dielectric support film. The high frequency apparatus has a simple structure and reduced transmission loss and can be made in a simple manufacturing process.
申请公布号 US7030721(B2) 申请公布日期 2006.04.18
申请号 US20030421780 申请日期 2003.04.24
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 YOSHIDA YUKIHISA;NISHINO TAMOTSU;SUEHIRO YOSHIYUKI;LEE SANGSEOK;MIYAGUCHI KENICHI;JIAO JIWEI
分类号 H01F5/00;H05K1/02;H01F17/00;H01P1/203;H01P3/00;H01P3/08;H01P5/18;H01P11/00 主分类号 H01F5/00
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