发明名称 |
Solid-state imaging apparatus and manufacturing method thereof |
摘要 |
A light-transmitting member is previously formed, and then integrally molded during a process of molding a structure member. A solid-state imaging apparatus has: the structure member configured by an insulating resin and having a through-opening portion; a wiring portion which is formed on the surface of the structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member which is placed to cover the through-opening portion with being separated from the solid-state imaging element by a predetermined distance The light-transmitting member is configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin, and integrally molded with the structure member to be embedded at a peripheral portion into the structure member.
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申请公布号 |
US7029186(B2) |
申请公布日期 |
2006.04.18 |
申请号 |
US20020307174 |
申请日期 |
2002.11.29 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HARAZONO FUMIKAZU |
分类号 |
G02B5/20;G02B6/36;G11B7/12;G11B7/22;H01L23/02;H01L27/14;H01L27/146;H04N5/335 |
主分类号 |
G02B5/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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