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发明名称
半导体测试系统
摘要
一半导体测试系统包括一测试装置,该测试装置被用以测试包含冗余电路之半导体元件,以获取该半导体元件之缺陷部分的失败资讯;以及一冗余修补判断装置,该冗余修补判断装置与该测试装置独立设置,并包含储存该失败资讯之失败记忆体以及一冗余修补判断单元,以依据该失败记忆体中所储存之失败资讯判断以该冗余电路替换该半导体元件之缺陷部分的冗余修补是否可以进行,其中该测试装置与该冗余修补判断装置透过一网路互连,且该失败资讯从该测试装置被传输至该冗余修补判断装置。
申请公布号
TW200612508
申请公布日期
2006.04.16
申请号
TW094108168
申请日期
2005.03.17
申请人
富士通股份有限公司
发明人
矢野智巳;冈本幸造;森本琢巳
分类号
H01L21/66
主分类号
H01L21/66
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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