| 摘要 |
PROBLEM TO BE SOLVED: To provide a display device, having a heat dissipating structure capable of efficiently cooling electronic components that reach a high temperature. SOLUTION: A frame 20 having the heat-dissipating structure for an electronic component 23 is disposed by bonding to the back side of a back substrate 4 of a display panel 10. The electronic component 23 is thermally connected to a hollow reinforcing frame 22 of the frame 20 via a heat sink 25. Thus, the heat dissipation for the electronic component 23 can be carried out efficiently. COPYRIGHT: (C)2006,JPO&NCIPI
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