| 摘要 |
PROBLEM TO BE SOLVED: To efficiently detect the flaw of the pattern formed on a semiconductor substrate or the like corresponding to an inspection region. SOLUTION: This flaw detector 1 is equipped with an imaging part 3 for imaging a substrate 9 to acquire a multi-gradation image to be inspected and the respective pixel images of the image to be inspected is successively outputted to a flaw detection part 43. In the flaw detection part 43, the image to be inspected is compared with a reference image and flaw region images showing the flaw regions contained in a plurality of predetermined inspection regions are formed to be stored in a flaw region image memory 44. The areas and center-of gravity positions of the respective flaws in the flaw region images are calculated in a computer 5 to specify the inspection region to which respective flaws belong and the flaws are restricted on the basis of the flaw judging conditions set at every inspection region in relation to the areas of the flaws. The flaws can be efficiently detected using the flaw judging condition related to the areas different corresponding to the inspection regions. COPYRIGHT: (C)2006,JPO&NCIPI
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