| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is used as a thermally curable adhesive for adhesive uses requiring heat resistance, has improved stability at room temperature, although being a one-pack type adhesive, can be cured at a temperature of≤100°C, and has excellent adhesive reliability. SOLUTION: This resin excellent comprises (A) a reaction product of a compound represented by general formula (1) (R<SP>1</SP>is H or a twenty or more carbon alkyl; R<SP>2</SP>is H or methyl; R<SP>3</SP>is H or methyl) with an acryloyl group-having compound, (B) a compound having two or more glycidyl groups in the molecule, and (C) a filler. COPYRIGHT: (C)2006,JPO&NCIPI
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