发明名称 MOLDING DEVICE AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To efficiently discharge a molding from a die in a crack-free state, and to realize continuous molding. SOLUTION: The molding device has a die structure in which an upper die 1 and a lower die 2 divided to the vertical direction, i.e., upward and downward, and a left punch 3 and a right punch 4 made movable to the horizontal direction are combined. The molding device is further provided with an upper coil 6 and a lower coil 7 of applying magnetic fields, and transverse magnetic field molding is performed. A molding 5 is moved to the horizontal direction in a state of being held by the light and right punches 3, 4, and is discharged from a die space. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006095567(A) 申请公布日期 2006.04.13
申请号 JP20040285040 申请日期 2004.09.29
申请人 TDK CORP 发明人 KIKUCHI MASARU;SATO SADAKI;SATO TAKASHI;KUNIYOSHI YOICHI;SATO KAZUO
分类号 B30B11/00;B22F3/02;B22F3/035;B30B11/02;C22C1/04;C22C33/02;C22C38/00;H01F41/02 主分类号 B30B11/00
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