| 摘要 |
A semiconductor device package has a concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency. An encapsulation body of polymer-based material encapsulates a semiconductor device and bonding wires, and a concavity structure is patterned on the encapsulation body by imprinting, laser drilling, photolithography, dry etching, die sawing, or other surface patterning technologies.
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