发明名称 System and apparatus for magnetron sputter deposition
摘要 A magnetron sputter coating apparatus is provided for coating the interior surface of a hollowed workpiece with sputter material from a sputter target material having a longitudinal bore. The apparatus includes a magnet assembly positionable substantially within a sputter target material disposed within workpiece and radially inward of the interior surface of the workpiece. The apparatus also includes a support structure supporting a plurality of magnets such that the magnets are circumferentially spaced apart about the support structure and such that a circumferentially directed magnetic field is generated about the sputter target material.
申请公布号 US2006076235(A1) 申请公布日期 2006.04.13
申请号 US20040963341 申请日期 2004.10.12
申请人 SOUTHWEST RESEARCH INSTITUTE 发明人 WEI RONGHUA
分类号 C23C14/00 主分类号 C23C14/00
代理机构 代理人
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