Halbleiterbaustein mit Leiterrahmen und Justierhilfen

摘要

In a semiconductor component with a lead frame connected to an encapsulated chip which has long and short sides and central connection pads at the centre of its active surface, the central connection pads are arranged along the long sides and peripheral connection pads are arranged adjacent the short sides so that (a) the inner lead frame connection fingers (10) at the long sides are directly joined to the active chip surface and are electrically connected to the central connection pads and (b) the inner lead frame connection fingers (12), located at and ending at a distance from the short chip sides, are electrically connected to the peripheral connection pads. Preferably, the fingers (10) are joined to the chip by an electrically insulating adhesive, especially a double-sided adhesive tape of polyimide.