| 摘要 |
<p>A semiconductor bridge circuit apparatus that realizes short reaction time before spark emission and also realizes a large amount of spark emitted. There is provided a semiconductor bridge circuit apparatus comprising a substrate and, superimposed thereon, a pair of land portions and a bridge circuit portion for electrically connecting of the pair of land portions, the semiconductor bridge circuit apparatus adapted to emit sparks at the bridge circuit portion upon current passage through an electrode pad disposed on the upper surface of the pair of land portions, wherein the pair of land portions and the bridge circuit portion are constituted of a layer laminate composed of, piled one upon another, multiple metal layers and metal oxide layers, and wherein the uppermost layer of the layer laminate is a metal layer, the metal oxide of the metal oxide layers being one of > 1500°C decomposition temperature.</p> |
