SUBSTRATE INSPECTION DEVICE, SUBSTRATE INSPECTION METHOD, INSPECTION LOGIC FORMING DEVICE OF SUBSTRATE INSPECTION DEVICE AND INSPECTION LOGIC FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a technique which enables the judgment of the quality of a solder fillet in a high-density mounting substrate with high-precision. SOLUTION: The substrate inspection device is constituted so that a first pixel region of a bluish color is first extracted from an inspection image according to a first logic to judge whether the characteristic quantity possessed by the first pixel region satisfies a first judge condition. Next, a second pixel region of a reddish color is extracted from the inspection image according to a second logic by the substrate inspection device to judge whether the characteristic quantity possessed by the second pixel region satisfies a second judge condition. When both of the judge results of the first and second logics are real, a part to be inspected is judged to be a good product. COPYRIGHT: (C)2006,JPO&NCIPI