| 摘要 |
PROBLEM TO BE SOLVED: To provide a Bi-containing hot-dip galvanizing technique which can realize a Pb-free state and a Cd-free state in a hot-dip galvanizing layer and is excellent in protection of a plating bath. SOLUTION: The Bi-containing hot-dip galvanizing is characterized in that the content of a Bi component in a molten zinc in a plating bath is 0. 00-2.5% by mass. By incorporating the Bi component in the plating bath in amount of a predetermined proportion, a plating layer which has excellent plating adhesion and corrosion resistance and good quality of product appearance, is formed. In particular, from the viewpoint of reducing environmental loading substances, the content of the Pb component and the content of the Cd component in the hot-dip galvanizing layer are preferably≤0.1% by mass and≤100 ppm, respectively, and ideally≤0.01% by mass and≤10 ppm, respectively. COPYRIGHT: (C)2006,JPO&NCIPI
|
