发明名称 SPUTTERING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an ECR (Electron Cyclotron Resonance)sputtering system capable of performing the film deposition sputtering on a substrate to which the low-temperature film deposition is requested. SOLUTION: In the ECR sputtering system, double shutters to prevent film deposition on a substrate caused by the pre-sputtering before the film deposition are arranged between a target 3 and a substrate 4. The shutters 1, 2 are opened during the film deposition mode, and closed during the non-film deposition mode such as during the pre-sputtering. The shutter 1 formed of a stainless steel plate which is less damaged by ions, electrons and sputter flux is arranged on the plasma side, and the shutter 2 formed of an aluminum alloy having a low radiation ratio is arranged on the substrate 4 side. The heat radiation during the pre-sputtering mode is prevented thereby, and the sputtering in a low-temperature range can be realized by suppressing the temperature rise of the substrate 4 to be low. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006097084(A) 申请公布日期 2006.04.13
申请号 JP20040284613 申请日期 2004.09.29
申请人 SHIMADZU CORP 发明人 SHIMOZATO YOSHIHIRO
分类号 C23C14/34 主分类号 C23C14/34
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