| 摘要 |
PROBLEM TO BE SOLVED: To especially provide a method for sealing an MEMS device from ambient conditions regarding a microelectromechanical system (michroelectromechanical systems) (MEMS). SOLUTION: Hereinafter, the method for sealing the microelectromechanical system (MEMS) device 76 from the ambient conditions is described. The MEMS device 76 is formed on a substrate 72. Hermetic sealing 78 is substantially formed as a part of an MEMS manufacturing process. The method includes formation of a metallic seal 78 on the substrate adjacent to the periphery of the MEMS device 76 by using a method like photolithography. The metallic seal 78 is formed on the substrate while holding a sacrifice layer between conductive members of an MEMS element in the MEMS device 76. The sacrifice layer is removed after the formation of the seal and before mounting a backplane 74. COPYRIGHT: (C)2006,JPO&NCIPI
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