发明名称 SUBSTRATE INSPECTION METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To improve the precision of inspection by setting an inspection area to an inspection target portion with high precision. <P>SOLUTION: A whole image 103 of a substrate to be inspected is created preliminarily, and an inspection area 31 is associated with an inspection target portion on the whole image 103. At the time of inspection, a camera 3A is positioned correspondingly to an imaging target area 30 to capture a processing target image 40. An area 41 corresponding to the processing target image 40 is extracted from the whole image 103, and offset values &Delta;x and &Delta;y of the area 41 relative to the imaging target area 30 are calculated. The set position of the inspection area 31 is corrected by using the offset values &Delta;x and &Delta;y, and the inspection area is set to the processing target image 40, based on the corrected coordinates. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006099758(A) 申请公布日期 2006.04.13
申请号 JP20050255009 申请日期 2005.09.02
申请人 OMRON CORP 发明人 MURAKAMI KIYOSHI;ASANO YASUNORI;KINOSHITA TAKASHI;YOTSUYA TERUHISA
分类号 G06T1/00 主分类号 G06T1/00
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