| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device to be constituted as a package, thereby enhancing a production yield and a reliability. <P>SOLUTION: In a semiconductor substrate 1, a window 20 which exposes a first wiring 3 is formed only in a region where the first wiring 3 exists. Thus, by increasing a region where the semiconductor substrate 1 adheres to a glass substrate 4 via an insulating film 2 or resin 5, an occurrence of cracks or a separation is prevented. Also, after the window 20 is formed, a first protective film 25 is formed so as to coat a second wiring 8, and a cutout 30 is formed along a dicing line. After the cutout 30 is coated with a second protective film 10, dicing is made for isolating a semiconductor device into individual semiconductor chips. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
