| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding machine for a semiconductor wafer and a grinding method thereof that can prevent a chip of a semiconductor wafer from cracking after substrate mounting by increasing the mechanical strength of the chip and improve the productivity of a grinding stage without making the machine complex nor large-sized. SOLUTION: The machine is equipped with cylindrical grinding blades 3a to 3c having grinding wheels 2a to 2c formed on their surfaces and rotary shafts 4a to 4c provided extending to the centers of the grinding blades 3a to 3c to grind a reverse surface of the wafer W; and bearings 5a to 5c and grinding blade holders 6 where arms extend in three directions are provided at both ends of the rotary shafts 4a to 4c, and rotary mechanisms 7a to 7c such as motors for driving the grinding blades 3a to 3c to rotate are provided at one-end sides. While the grinding blades differing in mesh size are rotated in order, rough grinding to finish grinding is carried out to make grinding traces uniform at right angles to an orientation flat or notch of the wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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