ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING APPARATUS

摘要

An electronic component pickup method by which an electronic component held by a carrier by adhesion can be stably picked up at high productivity, an electronic component mounting method and an electronic component mounting apparatus. In the electronic component pickup method for picking up the chip (6), which is held on a sheet (5) by being adhered on an adhesive layer (5a), by using a holding tool (20), an adhesive containing a compound which generates nitrogen gas by ultraviolet irradiation is used as the adhesive layer (5a). In the pickup operation, the holding tool (20) is brought into contact with the upper surface of the chip (6), a light irradiation part (8) is positioned at a lower part of the chip (6), and the adhesive layer (5a) positioned on the rear surface side of the chip (6) is irradiated with ultraviolet rays from the lower surface side of the sheet (5). In a status where the nitrogen gas generated from the adhesive layer (5a) is forming a gas layer (G) on a bonding interface between the rear surface of the chip (6) and the adhesive layer (5a), the holding tool (20) is moved up to pick up the chip.