| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that, when a lead pin is joined with an end surface of a through conductor of a wiring board made of glass ceramic via an active metal containing Ag-Cu alloy brazing filler, low melting metal such as silver or copper included in the conductor diffuses into the active metal containing Ag-Cu brazing filler to cause a void in the through conductor to have continuity resistance of the conductor increased. <P>SOLUTION: A wiring board with a lead pin includes an insulation substrate 5 made of glass ceramic, the through conductor 7 formed on the insulation substrate 5 and mainly containing copper or silver, and the lead pin 1 bonded to one of end surfaces of the conductor 7 and containing at least one of iron, nickel and cobalt. The lead pin 1 is bonded to the through conductor 7 via a connection pad 2 made of an Ag-Cu alloy filler containing at least one of Ti, Zr and Hf. The through conductor 7 has a diffusion preventive layer 10 formed on one of end surfaces, comprising at least one of a Ni layer and an Au layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
