| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat storage material-microencapsulated solid material including a latent heat storage material, causing no damage of microcapsules in making the solid material and usable over a long period without declining in heat storage effect even if temperature change is applied repeatedly in the temperature range including the phase change temperature. <P>SOLUTION: The heat storage material-microencapsulated solid material is such that microcapsules including a heat storage material are made to adhere to one another together with a binder, wherein the modulus of the binder is lower than that of a resin constituting the film of the microcapsules. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
