| 摘要 |
PROBLEM TO BE SOLVED: To make compact and highly reliable a surface acoustic wave device mounting, on a package, a piezoelectric element in which a surface acoustic wave element is formed by flip-chip bonding. SOLUTION: The surface acoustic wave device includes a package having a linear expansion coefficient, and a piezoelectric element in which a surface acoustic wave element is formed, and which is mounted on the package by flip-chip bonding. The piezoelectric element is cut out of a single crystal having X, Y, Z crystallographic axes at a predetermined angle, has different linear expansion coefficients in the direction of advancement of a surface acoustic wave that is generated by the interdigital electrode of the surface acoustic wave element, and in a direction vertical thereto, and has, as a long side, the direction having a linear expansion coefficient close to the linear expansion coefficient of the package. COPYRIGHT: (C)2006,JPO&NCIPI
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