| 摘要 |
PROBLEM TO BE SOLVED: To provide technology by which an efficient heat radiation path can be formed between a heat radiation part in a concave part of an electronic parts surface and a case such as a bottom cover in an electronic equipment such as optical disk apparatus. SOLUTION: As constitution of the case, a heat transmitting material is held between a case surface part of the electronic parts and the case, a projection part in which at least plane outside dimension of its tip part is same as plane outside dimension of a concave part or less is provided at a position opposing to the concave part of the case surface part. The heat transmitting material is deformed by pressing by the projection part, a part thereof is inserted into the concave part, and it is made to surely contact the heat radiation part of the bottom part of the concave part. COPYRIGHT: (C)2006,JPO&NCIPI
|
