METHOD OF MANUFACTURING COVER GLASS FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a cover glass for a semiconductor package by which the surface is easily polished and the increase ofα-ray emission caused by the sticking of abrasive containing U or Th on the surface is prevented.

SOLUTION: A glass chip having≤0.01 c/cm2×hrα-ray emission is manufactured by polishing the surface of large-sized glass, removing the peripheral part thereof and chipping the inside part.

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