| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an efficient heat management system for electronic components including a high power density device. <P>SOLUTION: This cooling system for cooling the plurality of electronic components has: a concentrated supply source 12 having at least one ultrasmall cooler 13 configured such that it sends out a flow of a refrigerant; and a plurality of baffle plates configured such that they newly distribute the refrigerant above the electronic components. The electronic components are positioned inside a casing 4. The electronic component is selected from a central processing unit (CPU) 20, a disk drive mechanism 28, a memory card, a graphics card, a power source unit 36, and a group comprising combination thereof. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
