| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor apparatus capable of improving the reliability of the semiconductor apparatus and enhancing the assembling efficiency. <P>SOLUTION: A sealing resin forming a resin thin film 2a causes a dressing action on a blade 13 by cutting the resin thin film 2a and a feeder line 5d altogether in individual molding and individual device forming by dicing thereafter, and the sealing resin cuts off copper burrs drawn and going to get tangled with the blade 13 so that the adhesion of the copper burrs to the blade 13 can be suppressed, resulting in that production of the copper burrs on the cut face of a wire substrate can be prevented. Consequently, the reliability of the BGA (semiconductor device) is improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
