| 摘要 |
PROBLEM TO BE SOLVED: To recognize the position of a semiconductor chip in a wafer face after the wafer has been diced and cut into a plurality of semiconductor chips and each semiconductor chip has been picked up. SOLUTION: In a semiconductor apparatus, the plurality of semiconductor chips 21 constituting a wafer 20 have distinguishing marks 22 having a different shape for each semiconductor chip 21, and the distinguishing mark 22 is composed of a same layer as the wiring layer of the semiconductor chip 21 to be distinguished by a binary number. COPYRIGHT: (C)2006,JPO&NCIPI
|
