发明名称 METHOD FOR MANUFACTURING MOLDING CIRCUIT PART
摘要 PROBLEM TO BE SOLVED: To have excellent melting molding properties and an advantageous injection molding as the coating material of a secondary molded product, to remove this coating material simply and easily, and to materialize the reproduction of the profile of an accurate circuit pattern without contaminating an environment. SOLUTION: A substrate 1 is molded with the liquid crystal polymer of a plating grade, and the entire surface 11 of this substrate is roughened. This roughened surface is partially coated with a coating material 21 except for a circuit to be formed, and a plating catalyst 3 is applied to the surface except for this coated surface. The coating material is removed, and a plating 4 is performed on the surface to which the catalyst is applied. As the coating material, one selected from a group consisting of an enzyme decomposing property and alkali decomposing property polymer, for example, polybutylene succinate lactate (PBSL), is used. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100576(A) 申请公布日期 2006.04.13
申请号 JP20040284997 申请日期 2004.09.29
申请人 SANKYO KASEI CO LTD 发明人 YUMOTO TETSUO
分类号 H05K3/18 主分类号 H05K3/18
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