| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board structure which is excellent in reliability and economics, and electrically and physically joins substrates mutually and firmly with an economically small amount of solder. SOLUTION: The diameter of a through hole 11 provided to a ridged printed wiring board 10 is made smaller than the diameter of a through hole 21 provided to a flexible printed wiring board 20. A land 11a is provided to only the substrate junction surface of the through hole 11. The through hole land 11a and a through hole land 21b provided to the flexible printed wiring board 20 are adhered by solder 40 from on the flexible printed wiring board 20, and the ridged printed wiring board 10 and the flexible printed wiring board 20 are physically and electrically joined. COPYRIGHT: (C)2006,JPO&NCIPI
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