发明名称 Method for processing a substrate using multiple fluid distributions on a polishing surface
摘要 A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube in continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the dispense arm is controllable.
申请公布号 US2006079156(A1) 申请公布日期 2006.04.13
申请号 US20050262620 申请日期 2005.10.31
申请人 发明人 POLYAK ALEXANDER S.;TEPMAN AVI
分类号 B24B1/00 主分类号 B24B1/00
代理机构 代理人
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