| 摘要 |
A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics such as stress relaxation property (low stress properties), electric insulation properties, heat shock resistance, and heat resistance can be produced from the heat curable resin.
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