发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic component which prevents generation of damage on a ceramic layer and a rise in electric resistance inside a through hole. <P>SOLUTION: In the manufacturing method of a laminated piezoelectric element 1, a through electrode is formed inside a through hole by using a first conductive paste whose content of a conductive material is higher than that of a second conductive paste. Internal electrodes 2, 4, 6, 16 are formed in the surface of a green sheet by using the second conductive paste. Consequently, the contraction rate of the through electrode is lower than the contraction rate of the internal electrodes 2, 4, 6, 16 in breaking out binding and baking. Since contraction of the through electrode is restrained in breaking out binding and baking, a rise in electric resistance is prevented inside the through hole. Furthermore, since inhibition of contraction of the green sheet due to the internal electrodes 2, 4, 6, 16 is restrained in breaking out binding and baking, generation of damage on piezoelectric layers 3, 5 is prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100557(A) 申请公布日期 2006.04.13
申请号 JP20040284741 申请日期 2004.09.29
申请人 TDK CORP 发明人 SASAKI MASASHI
分类号 H01F17/00;H01G4/12;H01G4/232;H01G4/30;H01L41/083;H01L41/187;H01L41/22;H01L41/293;H02N2/00 主分类号 H01F17/00
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