| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition developable and giving a pattern with high resolution and a high film remaining rate, curable at a low temperature, and having excellent mechanical properties, adhesiveness, water absorptivity and high sensitivity as film characteristics after cured, and to provide a semiconductor device using the composition. <P>SOLUTION: The photosensitive composition contains (A) a cyclic olefin resin having an acidic group, (B) a photoacid generator, (C) a compound having a reactive group which can be coupled with the acidic group of (A) at a temperature of ≥130°C, and (D) filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
