| 摘要 |
PROBLEM TO BE SOLVED: To bond a sheet body or a plate member having an optical function to the cover glass of a solid state imaging device with a less man-hour at a low cost. SOLUTION: In a first process, the plate member having the optical function different from that of a glass substrate 26 such as an infrared cut filter substrate 17 and an optical low pass filter substrate 28 is bonded onto the substrate 26 which is a base material of the cover glass 12 of the solid state imaging device 3. In a second process, a number of spacers 11 are formed on the lower surface of the substrate 26, in a third process, the spacers 11 of the substrate 26 are bonded to a semiconductor wafer 32 in which a number of solid state imaging elements 9 are provided. In a fourth process, the substrate 26, substrate 27, substrate 28 and wafer 32 are diced by each element 9 to manufacture a number of the devices 3 in a batch. COPYRIGHT: (C)2006,JPO&NCIPI
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