| 摘要 |
PROBLEM TO BE SOLVED: To provide a removing device, a protective film forming device, a substrate processing system, and a removing method, capable of nicely removing a protective film constituent without affecting to a resist film even when the constituent of protective film, formed so as to cover the resist film, is adhered to the peripheral rim of the substrate. SOLUTION: In a coating treatment unit CF, a cover film consisting of a constituent soluble into alkaline water solution is formed on the surface of a substrate W with a resist film formed thereon. Further, in the coating treatment unit CF, developer used in a developing treatment unit can be supplied as removing liquid to remove the constituent of the cover film adhered to the peripheral rim of the substrate. According to this system, the cover film on the peripheral rim part of the substrate can be selectively removed without affecting to the resist film. COPYRIGHT: (C)2006,JPO&NCIPI
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