| 摘要 |
PROBLEM TO BE SOLVED: To obtain the mounting structure of a semiconductor device which is repairable and has high reliability against impact. SOLUTION: A first adhesive resin layer 2 which is stuck to a mounting wiring board, hardened, and peeled and removed, and a second adhesive resin layer 3 which is stuck to a semiconductor device and hardened with higher mechanical strength and a smaller coefficient of thermal expansion than the first layer 2, are layered between the semiconductor device 1 and a soldered mounting wiring board 4. COPYRIGHT: (C)2006,JPO&NCIPI
|
