发明名称 THREE-TERMINAL MULTILAYER CAPACITOR AND PACKAGING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To reduce ESL and to realize good decoupling over a wide frequency band. SOLUTION: GND electrodes 14 are provided longitudinally on side faces of a laminate 12 to cover entire breadthwise end surfaces of the laminate 12. Signal electrodes 16 and 18 are formed in a U-shape on longitudinal end surfaces of the laminate 12 to be sandwiched between GND electrodes 14. A GND-side conductor pattern 20 connected to the GND electrode 14 is formed to expose from the breadthwise end of a dielectric sheet 22 and not expose from a longitudinal end, and the breadthwise end 14A is joined with the GND electrode 14. A signal-side conductor pattern 24 connected to the signal electrodes 16 and 18 is formed to have the center exposed from the longitudinal end of a dielectric sheet 26 and not exposed from a breadthwise end, and longitudinal ends 16A and 18A are joined with the signal electrodes 16 and 18, respectively. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100451(A) 申请公布日期 2006.04.13
申请号 JP20040282853 申请日期 2004.09.28
申请人 TAIYO YUDEN CO LTD 发明人 SHIMIZU MASAYUKI
分类号 H01G4/12;H01G2/06;H01G4/252;H01G4/30;H05K1/18 主分类号 H01G4/12
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