发明名称 |
SPULENK RPER UND SPULE F R LEITERPLATTENMONTAGE |
摘要 |
The invention relates to a former and a coil for printed circuit board assembly, consisting of a prismatic or cylindrical coil form for at least one coil and a foot part, which is configured as one piece with the coil form, at least sections of said part protruding externally above the coil form. According to the invention, connecting wires for the coil or coils are formed from the coil wire and their ends are configured as solder terminals, which are housed and held in wire guides of the foot part. |
申请公布号 |
DE50302289(D1) |
申请公布日期 |
2006.04.13 |
申请号 |
DE2003502289 |
申请日期 |
2003.02.10 |
申请人 |
SIEMENS AG OESTERREICH, WIEN |
发明人 |
ROTHMAYER, THOMAS;WEINMEIER, HARALD |
分类号 |
H01F27/29;H01F5/04;H01F17/04;H01F27/02;H01F27/06;H01F27/32 |
主分类号 |
H01F27/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|