| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition excellent in sensitivity and improved in exposure latitude, pattern collapse, pattern profile and line edge roughness of a line pattern, and to provide a method for forming a pattern by using the composition. <P>SOLUTION: The positive resist composition contains an acid decomposable resin and a compound generating an acid by irradiation with active rays or radiation, wherein a positive resist composition is used which contains at least two kinds of acid decomposable resins polymerized by different polymerization initiators. In particular, the following positive resist composition shows preferable characteristics: the composition contains a resin polymerized by using a polymerization initiator having at least one substituent selected from -CN, -COOH, -OH and -NH-, and a resin polymerized by using a polymerization initiator having no substituent selected from -CN, -COOH, -OH and -NH-. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
