| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and equipment for press bonding an electronic component in which a plurality of electronic components are press bonded temporarily to the connection terminal of a substrate at appropriate positions through adhesive material before being press bonded actually, and mounting of a plurality of electronic components with temporary press bonding and actual press bonding is carried out efficiently, and also to provide a method and an apparatus for manufacturing an electrooptic device. <P>SOLUTION: In a press bonder 400, an actual press bonding head being actually press bonded next is selected previously for a driver IC being secured temporarily by a temporary press bonding unit 101, and secured temporarily by thermal press bonding to the terminal 2a of a positioned liquid crystal panel 12 through an ACF 9 as an adhesive material while taking account of a positional correction value depending on the selected actually press bonding head. The liquid crystal panel 12 temporarily secured with a plurality of driver ICs is conveyed to an actual press bonding unit having the selected actual press bonding head by a panel conveyance section 114, and the plurality of driver ICs secured temporarily are further press bonded thermally by the selected actual press bonding head, and bonded to the terminal 2a. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
