| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic component having high dimensional accuracy and excellent flatness. SOLUTION: The manufacturing method includes steps of: forming a conductor layer 2 on a green sheet 1; sandwiching and laminating a plurality of green sheets 1 with the conductor layer 2 between binding green sheets 5 which do not shrink substantially at their baking temperature to prepare a raw laminate 6; baking the raw laminate 6; and removing a binding layer made by baking the binding green sheets 5. The binding green sheet 5 consists of a first binding green sheet layer 3 with a smaller change of rate in thickness when laminated than that of the green sheet 1, and a second binding green sheet layer 4 containing a molten ingredient which melts when heated for laminating the binding green sheet 5. The second binding green sheet layer 4 is laminated in contact with the green sheet 1. COPYRIGHT: (C)2006,JPO&NCIPI |
