| 摘要 |
PROBLEM TO BE SOLVED: To efficiently fill an insulating resin material and realize highly dense wiring. SOLUTION: A bare chip 6 packaged in a chip packaging recess 5 formed on a multilayer wiring board 2 is sealed with an insulator resin material. The resin filling guide groove 17 of a height to the middle in the depthwise direction from a first principal plane 2a is formed on an inner wall of the recess 5. The insulating resin material is formed of the insulating resin material supplied from the needle 16 of a resin filling device inserted from an opening of the guide groove 17 and exposed into the recess 5. COPYRIGHT: (C)2006,JPO&NCIPI
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