WIRING BOARD, ELECTRIC APPARATUS USING THE SAME AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board wherein a wiring pattern using a conductive resin is formed on an insulating board and conduction resistance between its both ends is stably low and which is superior in adhesion to the insulating board, and to provide an electric apparatus using the same and its manufacturing method. SOLUTION: A wiring pattern 120 is formed on an insulating board 110 by using a conductive resin 130. In terms of the component density in the direction of thickness of the wiring pattern 120, a high-density resin component layer 150 is made higher in conductive component as it is apart from the insulating board 110, while a high-density resin component layer 150 is made higher in resin component as it is close to the insulating board 110, thus realizing such the wiring board 100 that is provided with the wiring pattern 120 low in conduction resistance with less variance of conduction resistance and superior in adhesion to the insulating board 110. COPYRIGHT: (C)2006,JPO&NCIPI