| 摘要 |
In a method and a corresponding apparatus for controlling and monitoring the vacuum brazing of power components and SMD components, in which the temperature of the process is controlled using an open thermocouple, which is arranged separate from the furnace heating and is integrated in a base plate serving as a heat buffer, the temperature of the process is monitored and measured directly at the point of contact between brazing material and component. The uniformity of the temperature distribution during the process is measured by means of a contactless optical measuring system.
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