SUBSTRATE SUPPORT HAVING DYNAMIC TEMPERATURE CONTROL

摘要

A substrate support (40) useful for a plasma processing apparatus includes a metallic heat transfer member (48) and an overlying electrostatic chuck (50) having a substrate (70) support surface. The heat transfer member (48) includes one or more passage through which a liquid is circulated to heat and/or cool the heat transfer member. The heat transfer member has a low thermal mass and can be rapidly heated and/or cooled to a desired temperature by the liquid, so as to rapidly change the substrate (70) temperature during plasma processing.